| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board which enhances operationality of a conductive layer and enables fine wiring by a method wherein a core basic material is used that the conductive layers are stacked on a metal support plate and insulation layers are stacked on these conductive layers. SOLUTION: In this method, in an insulation layer 4 of a core basic material 1 that conductive layers 3 are stacked on a metal support body 2 and the insulation layers 4 are stacked on these conductive layers 3, a via 4a for connecting electrically with the conductive layer 3 is formed. Further, as the via 4a is electrically connected to a wiring pattern 7a formed in a printed circuit board 7 corresponding to a disposition of this via 4a, a via formation face 1a of the core basic material 1 and a wiring pattern formation face of the printed circuit board 7 are stacked counter to each other. After the metal support body 2 is removed from the core basic material 1 to expose the conductive layer 3, a conductive wiring pattern 3a for electrically connecting this conductive layer 3 to the via 4a is formed. |
