IMPROVED ISOLATION IN MULTI-LAYER STRUCTURES

摘要

A multi-layer circuit structure with selectively disposed ground planes, selectively disposed signal lines for transmitting signals of a given wavelength at a first level and a second level, dielectric material disposed between each of said ground planes and said signal lines, selectively disposed transition regions for electrically connecting one of the signal lines at said first level to one of said signal lines at said second level, said transition regions having selectively located vias for interconnecting said ground planes, has said vias of a first transmission line being spaced at a distance of other than multiple half wavelengths of said signal relative to said vias of a second transmission line.