| 摘要 |
<p>A multiple layer backplane has a plurality of slots (1, 2) for accommodating plug-in modules, including plated throughbores (A, B, C) extending through the layers of the backplane. Predetermined plated throughbores are connected to each other through printed conductors (3) arranged in a plurality of layers one above the other. Electrical components (28) and termination circuits (20) are arranged in the spaces between adjacent slots (1, 2) and printed guard tracks (6) extend parallel along either side of said conductors, the guard tracks being connected through further plated throughbores (10) to a metallic surface coating of a ground potential layer. The electrical components (28) and termination circuits (20) are soldered to solder terminals (22) provided on the surface of the upper board of the backplane, and as many as possible conductors (23, 24, 25) are arranged on the upper board. <IMAGE></p> |
