| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject sealing agent exhibiting cured product characteristics of good bending resistance without breaking electronic parts such as module chips or coils, by providing a module packaging sealing material consisting of a specific cationic polymerization-based epoxy resin. SOLUTION: An IC module and antenna coil are sealed with a one-pack thermosetting cationic polymerization-based epoxy resin or one-pack UV-curable cationic polymerization-based epoxy resin with high flex resistance as a packaging sealing material, thus obtaining a sealed module core. The epoxy resin is pref. a glycidyl ether-type epoxy resin or alicyclic epoxy resin. This epoxy resin can be molded in a short time under low pressures, causing no deformation/breakage of the IC module, and affording a molded product good in surface smoothness. |
