Semi-conductor chip test probe and process for manufacturing the probe

摘要

This discloses a probe structure which does not rely on cantilevered wire and which has controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed, on a film stretched across a respective plurality of cavities established in a substrate. The cavities and the contact electrodes are aligned to one another and both positionally match selected I/O pads existing on a semi-conductor chip to be probed. Also disclosed is a probe utilizing a cantilevered, metalized oxide tongue extending across a cavity.