| 摘要 |
Disclosed is a copper recycling apparatus for a waste substrate. The copper recycling apparatus for a waste substrate comprises: a frame; a chamber installed to the frame, allowing a waste metal having a coated layer to be injected inside; a heating part installed to the frame to heat the frame; and a dust discharging part to discharge dusts of the coated layer combusted inside the chamber. The copper recycling apparatus separates metal from a waste metal by carbonizing a coated layer coated on the waste metal, thereby simply recycling the waste metal. |
