| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card that excels in bending resistance, with no excess resin flowing into a gap between an IC module and a through-hole side wall, even when only a core sheet having a through-hole is used as a core sheet and there is variation in the thickness of the core sheet or the height of the IC module.SOLUTION: Provided is an IC card manufacturing method having the steps of: mounting an IC module 13 on one side of a substrate sheet 11 and manufacturing an inlet; using a core sheet 21 having a through-hole a, accommodating the IC module in this through-hole, and superposing the core sheet on the inlet so that a gap x is created between a through-hole side face and an IC module side face; superposing a surface sheet so as to close up the through-hole of the core sheet; and heat-pressing the whole of this assembly to integrate it, the thickness of the core sheet being made thinner than the height of the IC module.SELECTED DRAWING: Figure 1 |
