| 摘要 |
PROBLEM TO BE SOLVED: To apply plating completely into a through hole so as to raise the reliability on wiring by providing hard gold plating at a terminal for external connection, inside a through hole, and in the first region of a terminal for chip connection, and providing soft gold plating in the second region of a terminal for chip connection. SOLUTION: A copper wiring pattern is made, and a part of the wiring on the chip mounting face of a substrate 1 is masked. At this time, a terminal for chip connection is masked, and a through hole 4 is not masked. Next, bright nickel plating and hard gold plating are performed sequentially and the wiring pattern is plated with hard gold. Next, after removal of the mask, the section 3 plated with hard gold is masked. Next, mat nickel plating and hard plating are performed in order, and soft gold plating is applied to the section not covered with a mask. Then, this mask is removed. As a result, soft gold plating 3 is applied to the terminal for chip connection on the semiconductor chip mounting face and the wiring in its periphery. |
