| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent peeling off a film at the substrate ends on which no base adhesion layer is formed at the formation of the film by the W-CVD. SOLUTION: A substrate holding mechanism comprises a substrate support base 10 and a holder 30 to hold a substrate 20 on the base 10. The holder has a shape memory alloy deformable by the temp. change during formation of a thin film. The holder is heated during film formation to form a film on the entire substrate surface, because it is structured so that its contacted part with the substrate 20 are not overlapped before and after heating, thus preventing the film peel near the oxide film exposed parts at the W-CVD film forming process.</p> |
