| 摘要 |
A support structure is provided between, preferably approximately midway between, a semiconductor die and the inner ends of the lead fingers of a lead frame. Intermediate portions of bond wires connecting the die to the lead fingers are bonded, or tacked, to an upper surface of the support structure. In this manner, the length of the bond wires can be doubled, and the lead fingers can be commensurately further from the die so that a greater number of lead fingers of a given size and spacing can be provided, while avoiding the problems associated with long bond wires. |
