| 摘要 |
PROBLEM TO BE SOLVED: To provide an ESD(electrostatic discharge) protection circuit and other buffer circuits such as decoupling capacitors, drivers and receivers, without occupying large areas on a core integrated circuit chip. SOLUTION: A package is composed of a complementary metal oxide semiconductor(CMOS) core integrated circuit ship 20, a support ship 22 and a lead 34 for external connection. The support ship 22 is provided with an ESD protection circuit and lead buffer circuits such as a decoupling capacitor, a driver and a receiver, for electrical connection with the core integrated circuit chip 20 and the leas 34. The yield and performance of a core integrated ship are improved by shifting the lead buffer circuits from the core ship and providing them on other support chips. |
