Methode zur Montage von Hybridschaltungen durch Vakuum-Verklebung

摘要

The method according to the invention consists in assembling at least two components, the first component being a rigid substrate of a hybrid electronic circuit, and the second component being a metal plate, the components being bonded by polymerisation of an adhesive film placed between the components to be assembled, the polymerisation taking place under a mechanical pressure exerted on these components, characterised in that the said mechanical pressure is applied uniformly over the entire surface of the components to be assembled. Advantageously, the uniformity of the pressure is obtained by a difference in pressure established between a first region containing the components and a second region containing the first region, the two regions being separated in a sealed manner by at least one flexible wall, the first region being evacuated by a vacuum pump; in addition, the mechanical pressure applied is that due to the atmospheric pressure which prevails in the second region, which bears on the walls of the first, evacuated region, and on the components to be assembled which are inside this first region.