发明名称 MODULAR CELL PLACEMENT SYSTEM WITH DISPERSION-DRIVEN LEVELIZING SYSTEM
摘要 A system for optimizing the density of cells located on a surface of a semiconductor chip divided into a plurality of rectangular regions is provided herein. The corners of these regions define nodes. The system comprises computing an average local cell density for regions adjacent to each node and deforming these regions by relocating nodes to positions that minimize a cost function associated with the densities of the new deformed regions bordering the relocated nodes.
申请公布号 WO9800799(A3) 申请公布日期 1998.02.05
申请号 WO1997US11099 申请日期 1997.06.26
申请人 LSI LOGIC CORPORATION 发明人 SCEPANOVIC, RANKO;KOFORD, JAMES, S.;ANDREEV, ALEXANDER E.
分类号 G06F17/50 主分类号 G06F17/50
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