Compact, direct mechanical- and electrical bonding of microcircuit to substrate

摘要

This new method bonds and connects an integrated circuit (10) to a substrate (26), directly. An anisotropically-conducting adhesive (14, 14a) is applied to the surface of either the integrated circuit, or the substrate (26). Distributed over both mating surfaces, there are corresponding, projecting patterns (28), designed to make connection. The parts are joined with the patterns orientated accordingly. The adhesive bonds them mechanically, at the same time completing the electrical connections. Also claimed are electronic circuit arrangements made as above.