| 摘要 |
PROBLEM TO BE SOLVED: To make the distribution of grinding pressure uniform on a thin plate surface so as to keep a grinding margin constant and to perform grinding of a high degree of flatness by using a plate to be deformed into a shape complementary to the surface condition of a grinding means and performing grinding while holding a thin plate on its thin plate holding surface. SOLUTION: A surface shape of a wafer holding surface of a wafer holding section 2a in a plate 2 is formed to be projected and curved so as to be flat, which is a surface shape of a level block 4, while the plate 2 is elastically deformed by a load 3 applied, as shown in Fig. a, to the projected curve, that is, the surface of the plate 2 during grinding, and a resisting force applied from a wafer 1 to the plate 2. Thus, a bent state is maintained when the wafer 1 is stuck to the surface of the wafer holding section 2a, but the wafer 1 is maintained completely flat, as shown in Fig. c, when the load 3 is applied to the upper surface of the plate 2. In this way, contact pressure in the surface of the wafer 1, that is, the distribution of grinding pressure, is made completely uniform. |
