| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which is possessed of solder bumps, lessened in heating frequency, and easily manufactured. SOLUTION: Eutectic solder paste is applied onto the front side of a wiring board 1 for the formation of a eutectic solder paste layer 21. A high-temperature solder ball 27 is put in recesses 23 provided to a recessed plate 25 respectively, and furthermore eutectic solder paste is applied onto the recessed plate to fill in the recesses 23 with squeegee printing the same as the front side of the wiring board 1. A front-side bump height control member 29 is arranged on the front side of the board 1, and the recessed plate 25 is brought into close contact with the rear side of the board 1 aligning the recesses 23 with pads. In this state, the board 1 is introduced into a reflow oven to melt only the eutectic solders located on the front side and rear side of the board 1 and then cooled down. By this setup, solder bumps 3a with flat tops used for flip- chip bonding are formed on the front side of the board 1, and solder bumps 3b of large diameter used for being bonded to a printed board are formed on the rear side of the board 1.</p> |
