| 摘要 |
PROBLEM TO BE SOLVED: To improve the productivity of a chip type solid electrolytic capacitor, by incorporating an undercoat applying process in a terminal fitting process. SOLUTION: An L-shaped section is provided at the end section of an anode terminal 5 on the side where the terminal 5 is connected to an anode lead wire 2 and, after an undercoat resin 3 is applied to the L-shaped section, the terminal 5 is connected to a capacitor element 1. Consequently, the resin 3 spreads to the lead-out surface of the lead wire 2 of the element 3 in a wet state. Then, the resin 3 is cured by heat treatment. Therefore, the applying and curing process of the undercoat resin 3 can be combined with the applying and curing process of a conductive adhesive 4, because both processes become similar to each other. |
