| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor substrate exposure device that hardly causes defocusing caused by displacement, etc., due to existence of dirt, etc., between the device and a semiconductor substrate supporting part. SOLUTION: A semiconductor substrate exposure device has a semiconductor substrate supporting part 40 and semiconductor substrate fixing parts 50a and 50b which have a form according with an outer peripheral form of a semiconductor substrate 30 and which are allowed to move on the semiconductor supporting part 40. It employs a structure in which contact parts of the semiconductor substrate fixing parts 50a and 50b for the semiconductor substrate 30 have recessed parts 70a and 70b, respectively, which separate the semiconductor substrate 30 from the semiconductor substrate supporting part 40. By employing the semiconductor substrate exposure device, the semiconductor substrate 30 is, when it is fixed, picked up with the recessed parts 70a and 70b which are formed on the semiconductor substrate fixing parts 50a and 50b, respectively, to be fixed while being separated from the semiconductor substrate supporting part 40. Therefore, defocusing due to interposition of dirt, etc., is hardly caused.</p> |
