| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce manufacturing cost by decreasing the number of processes and time required for manufacturing in a method for manufacturing a polyimide multilayer wiring film and a multilayer wiring board for mounting LSIs that operate at several hundreds MHz. SOLUTION: A via contact part 6 is formed at a raw material film where a thermoplastic polyimide layer 2 and a non-thermoplastic polyimide layer 3 are stack, and a metal film 7 is formed on the non-thermoplastic polyimide layer 3. Then, the metal film 7 is machined finely by the photolithography method, thus forming a wiring 7a. In this manner, a plurality of single plates 10 where the wiring 7a and the via contact part 6 are formed are formed, and the single plates 10 are overlapped, are heated to approximately 200 deg.C, are subjected to a pressure of 2-5kg/cm<2> for approximately 1 minute, thus forming the single plates 10 in one piece and completing a polyimide multilayer wiring film 12.</p> |
