| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of wire bonding by reducing the mounting area of a semiconductor element. SOLUTION: A bear chip element 2 as a semiconductor element is mounted on a substrate 1. And each electrode pad 4 is formed on the upper side surface of the gear chip element 2. Also, on the substrate 1, each hexagonal electrode pad 11 is formed having mutually the same shape with the tip portion 11B nearer to the bare chip element 2 being narrower than an intermediate portion 11A. And each electrode pad 11 is arrayed to a fan shape along a profile line S1 forming a projected curve shape against each side 2A of the bare chip element 2. Also, each electrode pads 4 and 11 are connected respectively through each bonding wire 6. |
