| 摘要 |
A method for bonding an attachment member to a substrate substantially simultaneously with the formation of a sealing member, and a panel assembly made according to the method. The method includes the steps of applying an adhesive to either the attachment member or the substrate, or both, and holding or otherwise retaining the attachment member against the substrate. A sealing member is deposited on the substrate and encapsulates at least a portion of the attachment member. Heat, generated by the polymeric material or added by an external source, causes the adhesive to cure, creating a strong secure bond between the attachment member and the substrate. The attachment member may then be used to mount the substrate to another surface and securely fixed thereto by an adhesive adapted to bond the surface and attachment member together.
|
