| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that the joining of the connection terminals of substrates to electronic parts has not been able to surely attain because the homogeneous dispersion of electroconductive particles has been difficult in anisotropic electroconductive adhesive. SOLUTION: The admixing of insulating particles (10B) in resin or solvent enables remarkable increase in the density of particle in an anisotropic electroconductive adhesive to attain almost uniform dispersion of electroconductive particles (10A) in the anisotropic electroconductive adhesive thereby ensuring the joining of the connection terminals of substrate (13) to electronic parts. Thus, an anisotropic electroconductive adhesive which can increase the yield of mount boards can be realized.</p> |
