| 摘要 |
<p>Ends (202b) of elongate interconnection elements, such as spring contact elements (202), effecting pressure connections to terminals of electronic components such as semiconductor devices resident on a semiconductor wafer are protected from adverse effects of undesired lateral forces by a 'floating' lateral support element (220). The floating lateral support (220) is a planar member which has a plurality of holes (208) through which the free ends (202b) of the elongate interconnection elements (202) extend, and permits a small (constrained) amount of independent lateral deflection for each interconnection element (202). When an individual interconnection element (212a) exceeds the permitted amount of lateral deflection, it 'bumps' into the sidewall of the respective hole in the floating lateral support (220) through which it extends, and further lateral deflection of the interconnection element is resisted by the floating lateral support (220) moving laterally with the laterally-deflected interconnection element (212a) and coming into contact with the remaining interconnection elements (212b, 212c, 212d), which will restrain further lateral movement of the laterally-deflected interconnection element (212a). Additional lateral displacement is prevented by a separate stop mechanism (330) located peripheral to the floating lateral support (320).</p> |
