| 摘要 |
An electronic module, particularly an electromagnetic interference module includes an assembly for providing a low impedance ground path for at least one electrical component on a printed circuit board of the module. A chassis of the module is employed as a ground source. The printed circuit board is a rigid flex printed circuit board constructed of multiple circuit layers including flexible and rigid circuit layers. The board has at least one rigid portion with both flexible and rigid circuit layers and at least one flexible portion constructed of at least one flexible circuit layer. An electrical component to be grounded is located on a rigid portion of the board. A flexible circuit layer of the rigid flex printed circuit board is used as a return making a direct ground path from the rigid flex printed circuit board to the chassis for grounding the electrical component.
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