| 摘要 |
PROBLEM TO BE SOLVED: To obtain a relief pattern developable with an alkaline solvent and high in resolution and sensitivity and superior in heat resistance by incorporating a specified compound and a carboxylic acid copolymer. SOLUTION: This photosensitive resin composition contains a compound represented by formula I in an amount of 1-100weight% of the total resin, and a carboxylic acid polymer represented by formula II and having a molecular weight of 10,000-1,000,000 in an amount of >=20weight% of the total resin. In formula I, R<1> is an o-quinonediazidosulfonyl group, R<2> is a 2-30C alkyl or aryl or alkaryl or heterocyclic group; R<3> is a 1-8C alkyl group or an H atom; (n) is 0-5; (m) is 1-6; R<4> is a 2-20C alkyl or aryl or alkaryl or heterocyclic group; and R<5> is a 1-20C alkyl group or H or a halogen atom. |
