发明名称 Dry etching method
摘要 Etching of an article is carried out by maintaining the article at a temperature at which the vapor pressure of etching gas molecules becomes equal to or higher than the pressure of etching gas and the vapor pressure of neutral radicals contained in a plasma becomes equal to or lower than the pressure of an etching gas. An etching pattern with a substantially vertical side profile and extremely small in dimensional shift from the mask can be formed at high precision.
申请公布号 US5705029(A) 申请公布日期 1998.01.06
申请号 US19950457748 申请日期 1995.06.01
申请人 HITACHI, LTD. 发明人 OKUDAIRA, SADAYUKI;TSUJIMOTO, KAZUNORI;TACHI, SHINICHI
分类号 H01L21/302;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/00 主分类号 H01L21/302
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