发明名称 |
Dry etching method |
摘要 |
Etching of an article is carried out by maintaining the article at a temperature at which the vapor pressure of etching gas molecules becomes equal to or higher than the pressure of etching gas and the vapor pressure of neutral radicals contained in a plasma becomes equal to or lower than the pressure of an etching gas. An etching pattern with a substantially vertical side profile and extremely small in dimensional shift from the mask can be formed at high precision.
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申请公布号 |
US5705029(A) |
申请公布日期 |
1998.01.06 |
申请号 |
US19950457748 |
申请日期 |
1995.06.01 |
申请人 |
HITACHI, LTD. |
发明人 |
OKUDAIRA, SADAYUKI;TSUJIMOTO, KAZUNORI;TACHI, SHINICHI |
分类号 |
H01L21/302;H01L21/3065;H01L21/3213;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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