Vacuum processing installation for application of thin layers to substrates

摘要

Vacuum installation for application of thin layers to substrates (2, 2') incorporates several processing stations (8, 9, 10) supported by a stationary cylindrical vacuum chamber wall (7) which houses a rotatably mounted inner cylinder (14) carrying substrate chambers (3-6). The wall (7) is provided with openings (11-13) which can be covered by the substrate chambers for application of a processing medium to the substrates. An outer wall (16, 16') surrounds the chamber wall, connects the processing stations, and forms outer chambers (15, 15'). At least one of these chambers is connected to the adjacent processing station (8, 10) and to a gas or monomer source (22, 23).