| 摘要 |
<p>PURPOSE:To obtain an IC card corresponding to a large-capacity memory or the like. CONSTITUTION:A thin substrate 2, such as a film, is used for an IC card. On the both surfaces of the substrate, ICs 3 are mounted. The substrate is bent and connected to a connector 1. As an electrically connecting means to the bent substrate, connector connecting pads are staggered so that a pattern wiring between the pads can be easily conducted. In this manner, a high packaging density is obtained by connecting the card to the connector using the bent part of the substrate. Because a connecting component part on the bent substrate is unnecessary, an IC card of a large-capacity memory or the like can be realized at a low cost.</p> |
