发明名称 DIELECTRIC THIN FILM CAPACITOR ELEMENT AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To suppress the increase of a leak current resulting from the current application time at a high temperature by a method in which an oxygen pore is provided in a dielectric thin film, and the dielectric thin film is composed of titanium, strontium and oxide material containing lanthanium. SOLUTION: In this dielectric thin film capacitor element, a silicon thermally oxidized film 2, a Ti adhesive layer 3, a Pt lower electrode layer 4, a dielectric thin film 5 consisting of oxide material containing titanium, strontium and lanthanium, and a Pt upper electrode layer 6 are successively formed on an n-type silicon substrate 1. SrTiO3 powder or S+TiO3 powder and BaTiO3 powder are sufficiently mixed until the density of La in an STO thin film or a BSTO thin film becomes the desired density, the mixture is sintered, and the obtained material is used as the sputtering target of a dielectric. As a result, a dielectric thin film capacitor element, having the insulating property which hardly deteriorates even when it is used at a high temperature for 1000 hours under application of DC voltage, can be obtained.
申请公布号 JPH09331035(A) 申请公布日期 1997.12.22
申请号 JP19960145423 申请日期 1996.06.07
申请人 SHARP CORP 发明人 KITA RYUSUKE;MASUDA YOSHIYUKI;MATSU YOSHIYUKI;OTANI NOBORU;YANO MORICHIKA
分类号 C01G23/00;H01G4/10;H01G4/33;H01L21/203;H01L21/822;H01L21/8242;H01L21/8246;H01L21/8247;H01L27/04;H01L27/105;H01L27/108;H01L29/788;H01L29/792 主分类号 C01G23/00
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