CIRCUIT BOARD, ITS MANUFACTURE, BUMP TYPE CONTACT HEAD USING IT, AND SEMICONDUCTOR PART MOUNTING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board on the surface of which small bumps having nearly equal heights are formed in a pattern and semiconductor parts can be mounted on the bumps at a high mounting density. SOLUTION: In a circuit board, an electroplated conductor circuit 2a is buried in an insulating base composed of a resist layer and an insulating substrate in a state where bumps 3 formed on the circuit 2a are exposed on the surface and the bumps 3 are electrically connected to the circuit 2a through electroplated columnar conductors 5. Each bump 3 is constructed in a multilayered structure in which two or more layered bodies 3a and 3b of different conductive materials are laminated and can be used as a contact head when an elastic member is arranged on the circuit board at the forming location of the bump.