| 摘要 |
PROBLEM TO BE SOLVED: To realize a printed wiring board which is resources-saving, environment-protecting, and low in cost by a method wherein a photosensitive insulating resin layer where a part which serves as a conduction circuit is removed by development is provided to the surface of an insulating board. SOLUTION: A photosensitive resin layer 2 is formed on the one side or both the sides of an insulating board 1 which serves as a supporting body. Then, a negative film is provided onto the insulating board 1 and irradiated with ultraviolet rays, a recessed part is provided onto the insulating board 1 by development, and conductive paste 3 is filled up into the recessed part for the formation of a one-sided or a double-sided copper-plated laminated board. Furthermore, when a multilayer printed wiring board is formed, a second photosensitive resin layer 4 is formed on the obtained one-sided or double-sided copper-plated board, a recessed part is provided in the copper-plated board by irradiation with light rays and development, and a second conductive paste 5 is filled in the recessed part. By this setup, a multilayer printed wiring board can be obtained. |
