| 摘要 |
<p>To develop a technology effective for efficiently producing a multi-layer printed wiring board having an interstitial via-hole structure with a high production yield, the present invention provides one-sided circuit board (7a, 7b, 7c, 7d) for a multi-layer printed wiring wherein a conductor circuit (3a, 3b, 3c, 3d) is formed on one of the surfaces of an insulating rigid substrate (2a, 2b, 2c, 2d), an adhesive layer (4a, 4b, 4c, 4d) is formed on the other surface, and via-holes (6a, 6b, 6c, 6d) are formed in such a way that holes are bored in the substrate and in the adhesive layer so as to penetrate through them and to come into contact with the conductor and a conductive paste (5) is packed into the holes. The present invention proposes also a multi-layer printed wiring board (1) having an IVH structure comprising the one-sided circuit board (7a, 7b, 7c, 7d) and a production method for producing efficiently the multi-layer printed wiring board (1) with a high yield.</p> |
