| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic circuit board where a wiring pattern is enhanced in cross sectional area and lessened in resistance and impedance, preventing a ceramic circuit board from both increasing in thickness as a whole and inducting delamination. SOLUTION: A multilayer ceramic circuit board is formed through such a manner that a buried part formed into a wiring pattern by blankening is provided to each of green sheets 11, 12, 14, and 15, conductive material is filled in the buried parts provided to the green sheets 11, 12, 13, and 14, and then the sheets 11, 12, 14, and 15 are laminated together. A manufacturing method of a multilayer ceramic circuit board is composed of a first process where a wiring pattern is punched out of a green sheet, and a second process where conductive material is filled in the punched wiring pattern of the green sheet. |
