| 摘要 |
PROBLEM TO BE SOLVED: To efficiently radiate out the generated heat by adhering the base ends of lead frames to the lower face of a semiconductor chip and sealing the frames and connecting means with a resin; the lead frames being elongated higher than the upper face of the chip and the base end lower faces and top end upper faces of the frames being exposed. SOLUTION: Prior to sealing lead frames 22 with a resin 26, the lower faces of second board connections 22b of the frames 22 are zigzag electrically connected to bond pads formed on the lower face of a semiconductor chip 21 through metal wires 24 and the lower faces of first board connections 22a are electrically connected to a metal pattern on a printed circuit board. Specified height H is set larger than the total thickness of the leads 22, adhesives, and chip 21. The heat generated from the chip is radiated from the base end lower faces and top end upper faces, resulting in a wide radiation area. This efficiently radiates out the generated heat from the chip. |
