I.C. DEVICE WITH CONCEALED CONDUCTOR LINES

摘要

This application discloses an integrated circuit device (10) comprising an integrated circuit die having top (16) and bottom (17) surfaces formed of electrically insulative and mechanically protective material and electrically insulative edge surfaces having exposed sections of conductive pads, the protective material being resistant to plastic dissolving solvents, and the integrated circuit die being readily damageable upon physical tampering with the integrated circuit device (10). A method for production of an integrated circuit device (10) which is resistant to techniques employed to remove integrated circuit packaging is also disclosed.