发明名称 RESIN COMPOSITION, AND FILM AND CURED SUBSTANCE PREPARED THEREFROM
摘要 PROBLEM TO BE SOLVED: To provide a resin composition, a film prepd. therefrom and a cured substance prepd. therefrom which are usable for preparing a patterned resistance and the like, and which enable not only the development with water or an aqueous alkaline solution, but also the preparation of a product which is excellent with respect to accuracy of formed patterns and has a very small conent of organic residues remaining after heating and calcination and further exhibits excellent adhesiveness. SOLUTION: Polymer A is prepd. by reacting a polymer (c), which is a polymer prepd. from a compound (a) having one (meth)acryloyl or vinyl group and one glycidyl group in one molecule thereof and an ethylenically unsaturated monomer (b) being copolymerizable with (a), with a compound (d) obtained by aminating one of the terminals of an oligo or polyethylene glycol and a compound (e) having one (meth) acryloyl or vinyl group and one carboxyl group in one molecule thereof. This resin composition comprises polymer A or a compound A' which is prepd. by adding a polycarboxylic acid anhydride to polymer A, a diluent B, a photopolymerization initiator C, at least one member D selected from the group consisting of a metal powder, a metal oxide and glass.
申请公布号 JPH09316112(A) 申请公布日期 1997.12.09
申请号 JP19960159283 申请日期 1996.05.31
申请人 NIPPON KAYAKU CO LTD 发明人 MORI SATORU;YOKOSHIMA MINORU
分类号 G03F7/38;C08F2/48;C08F283/06;C08L51/00;C08L51/02;C08L51/06;(IPC1-7):C08F2/48 主分类号 G03F7/38
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