发明名称 PHOTOPOLYMERIZABLE COMPOSITION AND ACRYLIC PRESSURE-SENSITIVE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain a photopolymerizable composition which, when it is subjected to polymerization by ultraviolet irradiation, is insuscepible to the adverse effect of oxygen, and can polymerize to a polymer having a high polymerization degree while maintaining a polymer yield at a high level, at a high polymerization rate, even when a thin film having a thickness of a 100μm or less is subjected to polymerization, and an acrylic pressure sensitive adhesive which is excellent with respect to the balance between adhesion strength and cohesion at high temperatures. SOLUTION: This photopolymerizable composition comprises a vinyl monomer component mainly composed of a (meth)acrylic alkyl ester, mixed with a photopolymerization initiator A having a molar light absorption coefficient at a wavelength of 365nm of 200 (1.mol<-1> .cm<-1> ) or more and a photopolymerization initiator B having a molar light absorption coefficient at a wavelength of 365nm of 200 (1.mol<-1> .cm<-1> ) or less. This acrylic type pressure sensitive adhesive is prepd. by a method comprising polymerizing the vinyl monomer component through irradiation of an ultraviolet ray to the above photopolymerizable composition.
申请公布号 JPH09316114(A) 申请公布日期 1997.12.09
申请号 JP19960135122 申请日期 1996.05.29
申请人 SEKISUI CHEM CO LTD 发明人 SAWADA HIDEKAZU;NAKASUGA AKIRA
分类号 C09J7/00;C08F2/50;C09J133/04;C09J133/06;(IPC1-7):C08F2/50 主分类号 C09J7/00
代理机构 代理人
主权项
地址