发明名称 SUCTION DEVICE FOR PARTS
摘要 PROBLEM TO BE SOLVED: To suck a variety of electronic parts without exchanging a nozzle head by providing a main body, the contact part of parts, which is provided for the main body and in which a plurality of holes are formed and an accumula tor for holding the parts in the contact part with suction force. SOLUTION: A suction device 200 is provided with the nozzle head 201 being the main body, the vacuum accumulator 202 and the contact part 203 of the parts. The nozzle head 201 is provided with an suction nozzle 204. The vacuum accumulator 202 is provided in the nozzle head 201 and it is connected to a vacuum pump 400. In the vacuum accumulator 202, the degree of vacuum is stabilized lest the internal degree of vacuum suddenly drops when the suction nozzle 204 sucks external air. A plurality of suction holes 300 are formed in the contact part 203 of the suction nozzle 204. The arrangement and the density of the holes 300 are set to be larger in a center part compared to an outer peripheral part. Even when small electronic parts are sucked, the invasion of air from the outer peripheral part is prevented as much as possible.
申请公布号 JPH09307287(A) 申请公布日期 1997.11.28
申请号 JP19960140915 申请日期 1996.05.10
申请人 SONY CORP 发明人 ISHIDA KENZO
分类号 B25J15/06;H05K13/04 主分类号 B25J15/06
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