发明名称 SPUTTERING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain metallic coating of good quality and to improve the using efficiency of a metallic target, at the time of forming multilayer coating by a reactive sputtering method, by applying specified pulse-shaped electric power in the case of the formation of metallic coating. SOLUTION: Cathode electrodes mounted with target material are plurally arranged in the conveying direction of a substrate, and coating of >= two layers is laminated on the substrate to be conveyed by a sputtering method. At least one layer of this multilayer coating is composed of metallic oxide coating or metallic nitride coating formed by a reactive sputtering. At the time of forming this metallic coating, periodical pulse-shaped electric power is applied to the metallic target. Namely, the pulse-shaped electric power in which the ratio given by the time for which the sputtering electric power is applied to the cathodes/(the time for which the sputtering electric power is applied + the time for which the sputtering electric power is not applied) is regulated to 0.5 to 0.05. The time for which the sputtering electric power is applied to the cathodes is preferably regulated to >=5μsec in one period.
申请公布号 JPH09302469(A) 申请公布日期 1997.11.25
申请号 JP19960115076 申请日期 1996.05.09
申请人 ASAHI GLASS CO LTD 发明人 SHIMIZU JUNICHI;EBISAWA JUNICHI;SUZUKI SUSUMU;YAMADA TOMOHIRO
分类号 C23C14/06;C23C14/08;C23C14/38;C23C14/56;(IPC1-7):C23C14/56 主分类号 C23C14/06
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