A heat dissipating spacer consisting of a silicone composition comprising from 55 to 95 vol% of a two-part addition reactive silicone and from 5 to 45 vol% of a heat conductive filler, the solidified product of the silicone composition having a thermal conductivity of at least 0.8 W/m.K and a compressibility of at least 10% under a load of 30 g/cm<2>.
