发明名称 Method of manufacting an SMD resistor
摘要 A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.
申请公布号 US5683566(A) 申请公布日期 1997.11.04
申请号 US19960649133 申请日期 1996.05.14
申请人 ISABELLENHUTTE HEUSLER GMBH KG 发明人 HETZLER, ULLRICH
分类号 H01C17/06;H01C1/084;H01C1/142;H01C7/00;H01C13/02;H01C17/245;H05K1/11;H05K1/18;(IPC1-7):H01C17/06 主分类号 H01C17/06
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