| 摘要 |
A method of manufacturing a semiconductor chip package. A sacrificial layer (100) is used as a base to selectively form an array of conductive pads (110) such that a central region (114) is defined by the pads. A back surface (122) of a semiconductor chip is attached to the sacrificial layer within the central region between the pads so that the contact bearing surface (121) of the chip faces away from the sacrificial layer. The chip contacts are then electrically connected to the respective pads, typically by wire bonding wires (130) therebetween. A liquid encapsulant (140) is then deposited. The encapsulant is cured and the sacrificial layer is either completely removed or is selectively removed to expose a surface of the pads for electrical attachment to a PWB and the back surface of the chip for creating a direct thermal path from the chip to the PWB. |
