| 摘要 |
PURPOSE: To reduce the thermal resistance of a package and to provide excellent heat resistance without reducing wire bondability by directly connecting a heat sink of the size to be superposed with the end of a lead terminal via a small gap to the end of the terminal and directly connecting it to the lower surface of a die pad. CONSTITUTION: A semiconductor element 10 is die bonded to a die pad 11. A metal heat sink 15 is coupled directly to the lower surface of the pad 11. The heat sink 15 is formed in a rectangular shape of the size to be superposed with the end of a lead terminal 12 as planely seen. The heat sink 15 is formed of metal having high thermal conductivity. The heat sink 15 is connected to the lower surface of the pad 11, and a small gap is interposed between the heat sink 15 and the terminal 12. The element 10, a metal fine wire 13, the heat sink 15, etc., are integrally molded with epoxy resin to obtain a semiconductor device having a small thermal resistance and excellent heat resistance without reducing wire bondability. |
