| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resistor having a low resistance temperature and a low resistance temperature coefficient by providing end electrodes so as to connect a resistance layer composed of a copper/nickel alloy formed at least on one surface of an insulating substrate, at a pair of its both end parts being opposed. SOLUTION: On one surface of a rectangular substrate 1, a resistance layer 3 is formed by printing and sintering a thick-film resistor paste obtained by adding copper powder, glass frit, and an organic vehicle component to copper/ nickel alloy powder. Next, end electrodes 5 are formed in such a way as to cover the one pair of both end parts being opposed of the substrate 1 into the shape of U, and to connect the sections not covered by the protective film layer 4 of the resistance layer 3. Besides, Ni-plated films 6 for covering these end electrodes 5 are formed, and solder-plated films 7 are formed on these Ni-plated films 6.</p> |
