| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer support which eliminates difference of the flow or the temperature distribution of introduced gas, makes the wafer quality uniform, and improves the productivity. SOLUTION: A jig for wafer treatment is formed to be conformable to the shape of a semiconductor wafer 5. The jigs are interposed between a plurality of wafer holding jigs 4, to be spaced a size apart from the wafers mounted on the outermost side which size is nearly equal to the specified mounting intervals of the semiconductor wafers 5. A space region formed between wafer holding jigs 3 can be made an approximately equivalent state that the semiconductor wafers are continuously connected. Thereby the flow of reaction gas in a reaction chamber is not disturbed, the temperature distribution can be made uniform, adverse influence upon the wafer 5 can be eliminated, dispersion of quality of the wafer 5 is reduced, and the yield can be improved.</p> |
