发明名称 BONDING WIRE SUPPLY AUXILIARY APPARATUS
摘要 PROBLEM TO BE SOLVED: To make it possible to prevent the engagement of bonding wirings due to entanglement at a bonding wire container for winding and containing the wirings. SOLUTION: The bonding wire supply auxiliary apparatus comprises a vibration giving unit 9 for giving vibration to a bonding wire 8 fed from a wire spool 1 for winding and containing the wire 8 in multilayers between the spool 1 and the initial guide 2a as seen from the spool 1. The unit 9 positively gives the vibration to the wire 8 after the new wire 8 is supplied from the spool 1. Thus, the engagement of the wire 8 due to entanglement at the spool 1 is prevented.
申请公布号 JPH09270439(A) 申请公布日期 1997.10.14
申请号 JP19960104119 申请日期 1996.03.29
申请人 SONY CORP 发明人 TAKAGI ETSUO
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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