| 摘要 |
PURPOSE:To realize a small-sized equipment, and enable the uniform heating of an object to be processed by bringing up and down a retaining rod installed on a heating unit when the object to be processed is mounted or demounted, and moving a conveying mechanism having a retaining arm, in order to carry the object to be processed. CONSTITUTION:A semiconductor wafer 12 on a conveying mechanism 20 is lifted up to a specified height by using a pin 22; a retaining plate 24a is positioned at the center of the wafer 12 by moving left a conveying mechanism 25: the wafer 12 is mounted on the retaining plate 24a by bringing down the pin 22; the mechanism 26 is moved right; the wafer 12 is mounted on the heating plate 13 by bringing up and down a pin 16 and moving the mechanism 25; heating is performed for a specified period. After the heating is finished, the wafer 12 is separated by using again the pin 16; the wafer 12 is carried by the mechanism 25. By bringing up and down the pin 16 in this manner, the wafer 12 is mounted on the heating plates 13, 14 and separated therefrom, so that the temperature distribution of the heating plates 13, 14 is uniformized. Thereby, the uniform heating of the wafer is enabled, and the equipment can be made small-sized. |
