| 摘要 |
An optoelectronic apparatus comprising a casing (110, 340) and an optical unit (100) on which at least one component (300) having high heat emission is disposed. This component (300) is initially linked with clearance (360) with the optical unit (100), by first fastening means (330), and in a second step by second fastening means (320) the component (300) is fixedly secured to the casing (110, 340) in a thermal-contact state. <IMAGE> |
