| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor device having a ball grid array structure to improve the package density thereof by forming balls in an array on the outer face of a cap base. SOLUTION: A cap 20 comprises a cap base 21 composed of a plate-like insulative member having an approximately square plain shape, balls 22 formed like an array on the outer face of the base 21, interconnection 23 connected to the balls 22, through-holes 24 piercing the base 21, and interconnection layer 25 on the base 21. The number of the balls per unit area on the top face of a semiconductor device is increased by increasing the balls 22 on the cap 20, this facilitating the miniaturizing of the package. Thus, the package density of the semiconductor device can be improved. |
