发明名称 DIAMOND INSIDE BLADE CUTTER
摘要 PROBLEM TO BE SOLVED: To lower cutting resistance, to lengthen dress interval and to decrease the number of dressing by providing a metal layer with high thermal conductivity at least on the surface layer of the top part of an abrasive grain layer of the surface layer of the abrasive grain layer. SOLUTION: A high tension stainless thin sheet is used as an alloy and a base metal 1 is placed between vinyl chloride discs 2 under a condition the interval is kept at about 0.3mm and it is immersed into a nickel plating liq. with a liq. compsn. with a plating hardness of about Hv250 and while electric plating is performed, diamond abrasive grains 3 are fixed to form an abrasive grain layer 4. The abrasive grain used in this case is a natural diamond with a mean particle diameter of about 30μm and the thickness of the plating of the abrasive grain layer is 85μm on one side. A inner peripheral blade whetstone with a blade edge structure is prepd. thereby. A metal layer 5 is formed on this with copper plating.
申请公布号 JPH09262821(A) 申请公布日期 1997.10.07
申请号 JP19960076739 申请日期 1996.03.29
申请人 MITSUBISHI MATERIALS CORP 发明人 HOSHI JUNJI;AKATA YUKIYA;SUDA NOBUO
分类号 B24D3/06;B24D5/12;B28D5/02;H01L21/301;H01L21/304;(IPC1-7):B28D5/02 主分类号 B24D3/06
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